LG Flatron W2234S (W2234S-SNI W2234S-BNI.AxxQP) Service Manual 1.pdf

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COLOR MONITOR

SERVICE MANUAL

CHASSIS NO. :

MODEL: W2234S

(W2234S-SNI/W2234S-BNI.Axx*QP)

xx * means sales region and module type

(AxxIQP: INL 5ms, AxxVQP: AUO 5ms)

CAUTION

BEFORE SERVICING THE UNIT,

READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

*To apply the MSTAR Chip .

CONTENTS

SPECIFICATIONS ................................................... 2

PRECAUTIONS ....................................................... 3

TIMING CHART ....................................................... 7

DISASSEMBLY........................................................ 8

BLOCK DIAGRAM....................................................10

DISCRIPTION OF BLOCK DIAGRAM ................... 10

ADJUSTMENT ...................................................... 12

SERVICE OSD ............................................... ..........14

TROUBLESHOOTING GUIDE .............................. 15

WIRING DIAGRAM ............................................... 22

EXPLODED VIEW....................................................... 23

REPLACEMENT PARTS LIST ................................. 24

SCHEMATIC DIAGRAM .............................................. 33

SPECIFICATIONS

1. LCD CHARACTERISTICS

Type

: TFT Color LCD Module

Status

H-sync

V-sync

Video

Power

LED

Active Display Area

: 22 inch

Pixel Pitch

: 0.282(H) x 0.282(V)

Power On

active ≤ 45W

Blue

Color Depth

: 16.7M

Surface Treatment

: Hard-coating (3H),

Haze=25% Anti-Glare

treatment

off

blanked

< 1W

Amber

off

blanked

< 1W

Amber

Power

Saving

Operating Mode

: Normally White

off

blanked

< 1W

Amber

Backlight Unit

: Top/Bottom edge side 4-CCFL

2. OPTICAL CHARACTERISTICS

Power Off

< 1W

Off

Burn in

Blue

2-1. Viewing Angle by Contrast Ratio 　

(a) For InnoLux MT220WW01-V0 panel

Left 85°/Right 85°; Top 80°/Bottom 80° at Min CR≥10

(b) For AUO M220EW01-V0 panel

Left 85°/Right 85°; Top 80°/Bottom 80° at Min CR≥10

2-2. Luminance

(a) For InnoLux MT220WW01-V0 panel

300cd/m 2 (Typ.) 220cd/m 2 (Min.) (6500k);170

cd/m 2 (Min.)(9300k)

(b) For AUO M220EW01-V0 panel

300cd/m 2 (Typ.) 220cd/m 2 (Min.) (6500k);170

cd/m 2 (Min.)(9300k)

6. ENVIRONMENT

6-1. Operating Temperature : 0°C to 40°C

6-2. Relative Humidity

: 20% to 80%

6-3. MTBF

: 60,000 HRS with 90% Confidence

Lamp Life

: 50,000 Hours (Min)

7. DIMENSIONS (with TILT/SWIVEL)

2-3. Contrast Ratio

(a) For InnoLux MT220WW01-V0: 1000 ׃1 (Typical);

700:1 (minimum)

(b) For AUO M220EW01-V0: 1000 ׃1 (Typical);

800:1(minimum)

3. SIGNAL (Refer to the Timing Chart)

3-1. Sync Signal Type

Width: 509.3mm

Depth: 206mm (W Base), 63.5mm (W/O Base),

60.5mm (W/O STAND&BASE)

Height: 431.3mm (W Base), 419.8mm (W/O Base), 338.6mm

(W/O STAND&BASE)

: Separate TTL; Composite;

Sync On Green

8. WEIGHT (with TILT/SWIVEL)

Net. Weight: 4.7+/-0.5 Kg

Gross Weight: 5.8+/-0.5 Kg

3-2. Video Input Signal

1) Type : Analog

2) Voltage Level : 700 mV +/- 5% (P-P)

3) Input Impedance : 75 Ω 　　

3-3. Operating Frequency: 31.5K~65.3K Hz

Horizontal :30 ~ 83 KHz

Vertical :56 ~ 75Hz

4. Max. Resolution

D-sub Analog: 1680*1050@60Hz

5. POWER SUPPLY

5-1. Power: AC 90~264V, 47.5~63Hz,

5-2. Power Consumption

PRECAUTION

WARNING

WARNING FOR THE SAFETY-RELATED COMPONENT.

BE CAREFUL ELECTRIC SHOCK !

• There are some special components used in LCD

monitor that are important for safety. These parts are

marked on the schematic diagram and

th e replacement parts list. It is essential that these

critical parts should be replaced with the

manufacturer’s specified parts to prevent electric

shock, fire or other hazard.

• If you want to replace with the new backlight (CCFL)

or inverter circuit, must disconnect the AC

adapter because high voltage appears at inverter

circuit about

650Vrms.

• Handle with care wires or connectors of the

inverter circuit. If the wires are pressed cause short

and may burn or take fire.

• Be careful while tilting and rotating the monitor to

avoid pinching hand(s)

• Do not modify original design without obtaining written

permission from manufacturer or you will void the

original parts and labor guarantee.

TAKE CARE DURING HANDLING THE LCD MODULE

WITH BACKLIGHT UNIT.

• Must mount the module using mounting holes arranged

in four corners.

• Do not press on the panel, edge of the frame strongly

or electric shock as this will result in damage to the

screen.

Leakage Current Hot Check Circuit

AC Volt-meter

Good Earth Ground

such as WATER PIPE,

CONDUIT etc.

To Instrument's

exposed METALLIC

PARTS

• Protect the module from the ESD as it may damage the

electronic circuit (C-MOS).

1.5 Kohm/10W

• Make certain that treatment person’s body is

grounded through wrist band.

• Do not leave the module in high temperature and in

areas of high humidity for a long time.

• The module not be exposed to the direct sunlight.

• Avoid contact with water as it may a short circuit within

the module.

• If the surface of panel become dirty, please wipe it off

with a soft material. (Cleaning with a dirty or rough cloth

may damage the panel.)

CAUTION

Please use only a plastic screwdriver to protect yourself

from shock hazard during service operation.

SERVICING PRECAUTIONS

CAUTION: Before servicing receivers covered by this

service manual and its supplements and addenda, read

and follow the SAFETY PRECAUTIONS on page 3 of this

publication.

NOTE: If unforeseen circumstances create conflict

between the following servicing precautions and any of the

safety precautions on page 3 of this publication, always

follow the safety precautions. Remember: Safety First.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC

power source before;

a. Removing or reinstalling any component, circuit

board module or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical

plug or other electrical connection.

c. Connecting a test substitute in parallel with an

electrolytic capacitor in the receiver.

CAUTION: A wrong part substitution or incorrect

polarity installation of electrolytic capacitors may

result in an explosion hazard.

d. Discharging the picture tube anode.

2. Test high voltage only by measuring it with an

appropriate high voltage meter or other voltage

measuring device (DVM, FETVOM, etc) equipped with a

suitable high voltage probe.

Do not test high voltage by "drawing an arc".

3. Discharge the picture tube anode only by (a) first

connecting one end of an insulated clip lead to the

degaussing or kine aquadag grounding system shield

at the point where the picture tube socket ground lead is

connected, and then (b) touch the other end of the

insulated clip lead to the picture tube anode button,

using an insulating handle to avoid personal contact

with high voltage.

4. Do not spray chemicals on or near this receiver or any of

its assemblies.

5. Unless specified otherwise in this service manual,

clean electrical contacts only by applying the following

mixture to the contacts with a pipe cleaner, cotton-

tipped stick or comparable non-abrasive applicator;

10% (by volume) Acetone and 90% (by volume)

isopropyl alcohol (90%-99% strength)

CAUTION: This is a flammable mixture.

Unless specified otherwise in this service manual,

lubrication of contacts in not required.

6. Do not defeat any plug/socket B+ voltage interlocks

with which receivers covered by this service manual

might be equipped.

7. Do not apply AC power to this instrument and/or any of

its electrical assemblies unless all solid-state device

heat sinks are correctly installed.

8. Always connect the test receiver ground lead to the

receiver chassis ground before connecting the test

receiver positive lead.

Always remove the test receiver ground lead last.

9. Use with this receiver only the test fixtures specified in

this service manual.

CAUTION: Do not connect the test fixture ground strap

to any heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be

damaged easily by static electricity. Such components

commonly are called Electrostatically Sensitive (ES)

Devices. Examples of typical ES devices are integrated

circuits and some field-effect transistors

and semiconductor "chip" components. The

f o ll o wi n g techniques should be used to help reduce the

incidence of component damage caused by static by static

electricity.

1. Immediately before handling any semiconductor

component or semiconductor-equipped assembly, drain

off any electrostatic charge on your body by touching a

known earth ground. Alternatively, obtain and wear a

commercially available discharging wrist strap device,

which should be removed to prevent potential shock

reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with

ES devices, place the assembly on a conductive

surface such as aluminum foil, to prevent electrostatic

charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or

unsolder ES devices.

4. Use only an anti-static type solder removal device.

Some solder removal devices not classified as "anti-

static" can generate electrical charges sufficient to

damage ES devices.

5. Do not use freon-propelled chemicals. These can

generate electrical charges sufficient to damage ES

devices.

6. Do not remove a replacement ES device from its

protective package until immediately before you are

ready to install it. (Most replacement ES devices are

packaged with leads electrically shorted together by

conductive foam, aluminum foil or comparable

conductive material).

7. Immediately before removing the protective material

from the leads of a replacement ES device, touch the

protective material to the chassis or circuit assembly

into which the device will be installed.

CAUTION: Be sure no power is applied to the chassis

or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged

replacement ES devices. (Otherwise harmless motion

such as the brushing together of your clothes fabric or

the lifting of your foot from a carpeted floor

can generate static electricity sufficient to damage an

ES device.)

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and

appropriate tip size and shape that will maintain tip

temperature within the range or 500F to 600F.

2. Use an appropriate gauge of RMA resin-core solder

composed of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a

mall wire-bristle (0.5 inch, or 1.25cm) brush with a

metal handle.

Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique

a. Allow the soldering iron tip to reach normal

temperature.

(500F to 600F)

b. Heat the component lead until the solder melts.

c. Quickly draw the melted solder with an anti-static,

suction-type solder removal device or with solder

braid.

CAUTION: Work quickly to avoid overheating the

circuitboard printed foil.

6. Use the following soldering technique.

a. Allow the soldering iron tip to reach a normal

temperature (500F to 600F)

b. First, hold the soldering iron tip and solder the strand

against the component lead until the solder melts.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad

and solder it.

3. Clean the soldered areas with a small wire-bristle

brush. (It is not necessary to reapply acrylic coating to

the areas).

"Small-Signal" Discrete Transistor

Removal/Replacement

1. Remove the defective transistor by clipping its leads as

close as possible to the component body.

2. Bend into a "U" shape the end of each of three leads

remaining on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the

corresponding leads extending from the circuit board

and crimp the "U" with long nose pliers to insure metal

to metal contact then solder each connection.

Power Output, Transistor Device

Removal/Replacement

1. Heat and remove all solder from around the transistor

leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the

circuit board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close

as possible to diode body.

2. Bend the two remaining leads perpendicular y to the

circuit board.

3. Observing diode polarity, wrap each lead of the new

diode around the corresponding lead on the circuit

board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder

joints of the two "original" leads. If they are not shiny,

reheat them and if necessary, apply additional solder.

Fuse and Conventional Resistor

Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board

hollow stake.

2. Securely crimp the leads of replacement component

around notch at stake top.

3. Solder the connections.

CAUTION: Maintain original spacing between the

replaced component and adjacent components and the

circuit board to prevent excessive component

temperatures.

c. Quickly move the soldering iron tip to the junction of

the component lead and the printed circuit foil, and

hold it there only until the solder flows onto and

around both the component lead and the foil.

CAUTION: Work quickly to avoid overheating the

circuit board printed foil.

d. Closely inspect the solder area and remove any

excess or splashed solder with a small wire-bristle

brush.

IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong)

through which the IC leads are inserted and then bent flat

against the circuit foil. When holes are the slotted type,

the following technique should be used to remove and

replace the IC. When working with boards using the

familiar round hole, use the standard technique as

outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation

by gently prying up on the lead with the soldering iron

tip as the solder melts.

2. Draw away the melted solder with an anti-static

suction-type solder removal device (or with solder

braid) before removing the IC.

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