led0512.pdf

www.ledsmagazine.com

Technology and applications of light emitting diodes

LEDs Magazine

Review

Issue 4

LED S

MAGAZINE

December 2005

Editor: Tim Whitaker editor@leds.iop.org

Tel. +44 (0)117 930 1233 Advertising sales : joanna.hook@iop.org T el. +44 (0)117 930 1028

NEWS & ANALYSIS

Lexedis Lighting launched…Osram unveils

enhanced thin-film chips...Agilent becomes

Avago...LED market in mobile phones… p3

CONFERENCES

Delegates highlight required

LED lighting improvements p9

HIGH-POWER LEDS

3D packages from Lednium

provide wide-angle sources p15

SOLAR-POWERED LIGHTING

White LED home lighting

benefits India’s villages p17

LUMINAIRE DESIGN

The 5mm package versus the

power LED p19

LUMINAIRES

ConceptLED: concentrated

dispersion of light source p22

This unique dome-shaped package from Lednium can accommodate multiple high-power LEDs. p15

VEHICLES

Valeo employs LEDs in novel

automotive concepts p23

PACKAGING

LED lighting modules: taking

the heat out of the situation p27

DISPLAYS

Car manufacturers make a

stand with LED technology p29

VEHICLES

LEDs and concept cars at the

Frankfurt motor show p33

LEDs Magazine is published by IOP Publishing Ltd and Cabot

Media Ltd. Contact address: Institute of Physics Publishing,

Dirac House, Temple Back, Bristol BS1 6BE, UK.

AlbEO’s Repleo lighting system contains more

than 800 white LEDs in 5 mm packages. p19

Several hundred thousand RGB LEDs illuminated

the Lexus booth at the Frankfurt Motor Show. p33

LIGHTFAIR INTERNATIONAL 2005:

Best LED Product: Lamina BL-4000 RGB+

Technical Innovation Award: Lamina BL-4000 RGB+

Boasting 16 million pre-set or dynamic RGB colors,

the Lamina BL-4000 RGB+ LED system is compatible

with industry standard drivers and optics:

• the world’s brightest RGB LED light source module

• superior thermal management and interconnectivity

•architectural and architainment applications

• exceptional color mixing

• low profile, compact light source

• Also available

- BL-4000 White

- Heat Sinks

- Optics

- Wiring Harness

Learn more by visiting www.LaminaCeramics.com,

or call +01.609.265.1401

LED S

NEWS & ANALYSIS

MAGAZINE

BUSINESS

Lexedis Lighting proclaims

‘the rebirth of light’ at launch

and the Japanese company will focus on its core competency in high-

power LED chip technology. Lexedis will move into a purpose-built,

fully automated assembly facility in early 2006.

Lexedis products

Instead of talking about LED-based products, Lexedis claims to have

created a new species of solid-state light engine,which it has named

XED. Says Lexedis: rather than being an acronym, XED represents

“a significant evolution and possibly revolution in the nascent solid-

state lighting industry, and stands for dynamic, powerful, innovative

and durable light engines designed to provide ‘light for life’ ”.

The first XED products from Lexedis will be:

● The miniXED – a miniature (2.8

Lexedis Lighting GmbH, the LED lighting company formed in May

2005 as a joint venture between Tridonic Atco and Toyoda Gosei, was

officially launched in mid-December at Toyota’s recently redesigned

showroom in Paris, France.

Tridonic Atco, an Austrian-based supplier of lighting components

and LED lighting solutions, is a subsidiary company of the Zumtobel

Group, a leading lighting manufacturer. Toyoda Gosei is a pioneer

in InGaN LED technology and a leading supplier of high-brightness

LED chips. Japan-based Toyoda Gosei also supplies automotive parts

and is a subsidiary of the Toyota Group, which explains the location

of the Lexedis launch event.

Lexedis, based in Jennersdorf, Austria, is now the center of com-

petence for both parent companies in the field of solid-state light

engines. The company has inherited a strong intellectual property

arsenal in light conversion, chip architecture, packaging design and

numerous other innovations.

Lexedis will concentrate on high-power emitters, and will use inor-

ganic packaging materials and glass optics, as well as developing new

phosphor materials and methods of application. Tridonic will con-

tinue to focus on chip-on-board LED technology, which has advan-

tages in specific applications. The high-power LED packaging efforts

carried out by Toyoda Gosei in Japan will now be centered at Lexedis,

1.15 mm) surface-mount

solid-state light engine. Ranked as a 2 W device, it features a light

output of 35 lm, and a very low thermal resistance of only 10

3.4

C/W.

Its ceramic package and wireless bonding ensures the highest durability

and lowest lumen depreciation in its class. The miniXED is now

available at a color temperature of 4000 K.

● The XEDlamp – an ultra-compact spotlight (17

11 mm) that

incorporates the miniXED light engine. With an aluminum die-cast

body and a miniature plastic lens, the XEDlamp features an illuminance

level of 300 lx (without heat sink) and perfect uniformity. The lamp is

ideally suited for customers who require plug-and-play solutions.

● The powerXED – now under development at the Lexedis European

R&D center in Austria. This surface-mount device will be released in

3Wand 5 W versions in 2006. Significantly smaller than all competing

high-power LED devices (the package footprint is less than 45 mm 2 ),

the powerXED will demonstrate the superiority of XED technology

against LEDs, says Lexedis. It features an integrated miniature glass

lens (40°, 60° and 90°), a completely inorganic body, and a thin-layer

phosphor coating. The powerXED will be available in all colors with

best white-light quality.

The company says that in the coming years it will intensify its

Zumtobel

Group

Toyota

Group

luminaires

automobiles

Lexedis

Lighting

Toyoda

Gosei

Tridonic Atco

lighting components

LED lighting solutions

solid-state

light engines

automotive parts

LED chips

Lexedis is a joint venture between LED manufacturer Toyoda Gosei

and lighting component supplier Tridonic Atco. The new company

will benefit from the expertise of its parents on the lighting side (via

Zumtobel) and on the automotive side (via Toyota), although a large

proportion of Lexedis’s sales will be to external companies.

Links

Toyoda Gosei : www.toyoda-gosei.com/led

Tridonic Atco : www.tridonicatco.com

On our website:

More information and product photos

www.ledsmagazine.com/articles/news/2/12/16

Tridonic and Toyoda Gosei sign joint venture agreement

www.ledsmagazine.com/articles/news/2/3/17

Toyota Motor Europe recently unveiled its redesigned showroom

( Le Rendez Vous Toyota ) located in the Champs-Elysées, Paris,

and put LED technology at the center of its innovative multimedia

environment. Four large, high-resolution LED screens, supplied by

Toyoda Gosei, symbolize the notions of quality, energy saving and

advanced technology, which are intrinsic values of the Toyota brand.

ledsmagazine.com December 2005

LED S

NEWS & ANALYSIS

MAGAZINE

product development program. New XEDon light engines for auto-

motive applications will be released, as well as the high-efficiency

nanoXED range powered by Toyoda Gosei’s new mid-power core

emitters. The range of XEDlamp products based on powerXED

engines will also be extended, says Lexedis.

●

CHIP TECHNOLOGY

Osram announces enhanced

thin-film LED chip technology

Osram Opto Semiconductors has developed an advanced version of

its thin-film LED chip technology, which has already been incorpor-

ated into several advanced device-level products. In late November

Osram unveiled new Power TopLED packages that are available at

two brightness levels and in a different range of colors. The orange

Power TopLED, for example, is available in two versions with fluxes

of 3 lm or 7 lm, at an operating current of 50 mA.

Osram subsequently announced an addition to its Golden Dragon

family of high-power packages that is aimed specifically at automotive

applications such as daytime running lights. The device produces a

typical luminous flux of 64 lm from an operating current of 500 mA,

compared with 40 lm for the previous version, and has a forward volt-

age that has been reduced from 3.8 V to 3.2 V (typical). The company

says that an optimized package, combined with a special carrier mate-

rial, ensures excellent heat dissipation.

The new products are based on Osram’s thin-film chip technology,

which has been in production since 2002. The company continues to

make iterative improvements to the technology, which is applicable

to both InGaN-based devices (known as Power ThinGaN) and

AlGaInP-based devices.

The InGaN devices are grown on sapphire and wafer-bonded to a

reflective substrate, after which the sapphire is removed. The result-

ing device has a very thin emitting layer (hence the name) and is a sur-

face emitter, since almost none of the light is emitted from the device’s

side walls. This has important consequences since it enables the device

area to be scaled, and the devices also have a very low forward volt-

age. The AlGaInP devices are manufactured in a similar way on GaAs

substrates, but they incorporate a hexagonal microprism structure to

enhance light extraction (see www.ledsmagazine.com/articles/news/

1/1/2 fo r background on the chip processes).

The improved thin-film chip technology features in Osram’s Golden

Dragon high-power LEDs, which are aimed at daytime running lights.

Performance of white Golden Dragon with lens

350 mA

700 mA

1 A

R&D

Typical

R&D

Typical

R&D

Flux (volume converter) (lm)

Flux (chip-level converter) (lm)

102

126

Forward voltage (V)

3.0

3.2

3.3

3.5

Efficacy (lm/W)

Wall-plug efficiency (%)

The performance of white Golden Dragon packages with lens,

incorporating Power ThinGaN chips. As expected, performance is

better for R&D results compared with typical production values.

that the chip area can be scaled successfully. Calculations indicate that

a 1 mm Power ThinGaN will have around 98% of the total flux com-

pared with a 300

300 µm device for constant current density.

However, for a sapphire device with a transparent contact the light

output is reduced to 85% for the larger chip. For flip-chip devices on

sapphire and SiC substrates, the values are 75% and 58%, respectively.

AlGaInP and AlGaAs devices

Osram has already reported red AlGaInP thin-film devices in R&D

with an efficiency of 100 lm/W and external quantum efficiency (EQE)

of 50% at 20 mA. Typically for AlGaInP material, the EQE falls with

decreasing wavelength to around 10% near 590 nm.

The latest chips have been incorporated into Power Topled and

Golden Dragon packages, using 330 mm and 1 mm AlGaInP chips,

respectively. In Dragon packages with a lens, red 616 nm devices have

typical values of 121 lm at 800 mA with an efficacy of 57 lm/W and

a forward voltage of 2.5 V (2 W power dissipation). Efficacy is as high

as 90 lm/W at 50 mA. The values are roughly 20% less in packages

without a lens.

The thin-film technology has also been used in infrared-emitting

AlGaAs-based devices at 850 nm and 940 nm. At both wavelengths

Dragon packages without lenses have typical values of 470 mW and

40% efficiency for 1000 mA and 1.75 V forward voltage.

Power ThinGaN

Using the new Power ThinGaN 1 × 1 mm chips in a Golden Dragon

package with lens, Osram has achieved brightness values in R&D of

311mWin blue and 70 lm in green at 350 mA. Results for white emit-

ters are shown in the table. Values such as an efficacy of 59 lm/W and

a flux of 62 lm have been achieved at 350 mA. At low current, the effi-

cacy of these large-area chip packages shows a peak at 89 lm/W. At

higher currents, the output reaches 126 lm at 1 A, and the efficacy is

still high at 36 lm/W.

As the table shows, the performance of white LED packages is sig-

nificantly improved by using chip-level conversion technology, in

which the phosphor is coated directly onto the top surface of the chip.

In the traditional “volume converter” approach the chip is placed in a

cup that is filled with phosphor.

As mentioned above, a key advantage of ThinGaN technology is

●

ledsmagazine.com December 2005

with

Ultra

High

Bright

LEDs

The Only LED Lamps with a Pressure Release Structure (SLI / R-343 Series) .

Conventional Product

ROHM's SLI/R-343 Series

No Retouch Soldering

ROHM's pressure release structure

prevents pressure build-up during the

soldering process when the LED is

mounted on the PCB.

Air

Defects (holes) can occur

during soldering

Perfect soldering

(no holes)

Air

Pick a color. ROHM’s ultra high bright LEDs are available in many luminous colors.

Lamp LEDs

Wide Directivity

3mm

with

Pressure

Release

Structure

Although this lamp is a 3mm LED, its

directivity is equivalent to that of a 5mm LED

(luminous intensity half-power viewing angle

approximately 40º).

SLI-343URC

SLI-343DC

SLI-343YC

SLR343ECT

SLR343BCT

Many Luminous Colors

5mm

ROHM offers an LED lineup in a variety of

luminous colors using both AlGaInP

(a proprietary compound) and InGaN.

SLI-580UT

SLI-580DT

SLI-580YT

SLA580ECT

SLA580BCT

Chip LEDs

A Broad Lineup of LEDs

•Right angle chip LEDs

•Reverse mount chip LEDs

•Low current chip LEDs (ideal for portables)

•Dual color chip LEDs

•LED lamps with pressure release structure

•Direct mount LED lamps

Mini-Mold

SML-512UW

SML-512DW

SML-512WW

SML312ECT

SML312BCT

with

Reflector

Excellence in Electronics

SML-012UT

SML-012DT

SML-012YT

SML012ECT

SML012BCT

1.888.775.ROHM

www.rohmelectronics.com

Plik z chomika:

Inne pliki z tego folderu:

Inne foldery tego chomika: