62404di.pdf

(137 KB) Pobierz
659318084 UNPDF
design
ideas
Edited by Bill Travis
The best of
design ideas
8 Check it out at:
www.edn.com
Circuit produces variable numbers of burst pulses
Michael Kornacker, Northrop Grumman Corp, Rolling Meadows, IL
produce one to 15 burst pulses with
the same number of spaces between
the bursts at a pulse width (frequency)
that an external square-wave generator
at the input sets. The add-on circuit
produces a variable number of bursts
and a variable number of spaces be-
tween the bursts by using an external
square-wave generator as a source. The
project in this design required a TTL
burst signal, but resources did not allow
for the expense of a burst generator. The
circuit basically comprises two hexa-
decimal, divide-by-16 counters set up
so that the counter on the left produces
a user-selectable zero to 15 pulses and
the counter on the right produces a
user-selectable zero to 15 spaces. The
two hexadecimal thumbwheel switches
select the number of pulses and spaces.
Counter IC 1 controls the number of
bursts, and counter IC 2 controls the num-
ber of spaces. The two hexadecimal
thumbwheel switches, S 1 and S 2 , select the
count value. Each switch position is num-
bered zero to 15. S 1 controls the number
of burst pulses, zero to 15, and S 2 controls
the number of spaces, zero to 15. For ei-
ther the IC 1 or the IC 2 counter to count,
Pin 7 must be high. If Pin 7 is low, then the
counter remains disabled. For a counter to
be loaded with a desired count, Pin 9 must
be low and then high. The carry output at
Pin 15 is normally low until the counter
reaches a count of 15, and then it goes
high. When the circuit is powered on, re-
sistor R 1 and capacitor C 1 form an RC-
time-constant power-on-reset circuit at
Pin 1. This feature initializes the counters
Circuit produces variable numbers
of burst pulses ................................................ 79
Method provides fast, glitch-free isolation
of I 2 C and SMBus signals ............................ 80
Simulate input-offset current
for current mirrors.......................................... 84
Designing high current chokes
is easy .............................................................. 84
Publish your Design Idea in EDN . See the
What’s Up section at www.edn.com.
to the zero state upon power-up. After
that, the thumbwheel switches set the
count value.
When a clock signal arrives at the
counters’ Pin 2 with the desired fre-
quency, counter IC 1 starts counting up,
and counter IC 2 re-
mains in the off-state
because the low signal
at IC 1 ’s Pin 15 carry
output applied to IC 2 ’s
Pin 7 disables counter
IC 2 . When IC 1 ’s count
reaches the end (15), it
goes high and enables
IC 2 to count. IC 1 ’s car-
ry output also goes
through inverter gate
IC 3A and then to the
OR gate IC 4 ’s Pin 1.
The low signal on one
input of IC 4 —and the
fact that, because IC 2 is
now counting, its car-
ry output at Pin 15 is
also low at IC 4 ’s Pin
2—means that a low
signal appears at IC 1 ’s
Pin 7, and thus IC 1
now becomes dis-
abled. Both IC 1 and
IC 2 counters’ Enable
pins are cross-con-
S 1
S 2
0-F H PULSES
0-F H SPACES
5V
R 2
4.7k
R 6
R 7
R 8
R 9
4.7k
4.7k
4.7k
R 3
R 4
R 5
4.7k
4.7k
4.7k
4.7k
R 2
4.7k
16 10
V CC T
6
5 4 3
1
16 10
6
543
1
C 1
10
D8
D4
D2 D1
CLR
V CC T
D8
D4
D2 D1
CLR
F
FREQUENCY
INPUT
IC 3A
7404
2
IC 1
74161
15
2
CLK
IC 2
74161
15
CLK
CAR
CAR
1
2
P
GND
LD
P
GND
LD
7
8
9
7
8
9
IC 3B
4
7404
3
3
1
Figure 1
7432
IC 4
2
GATE
2
3 BURST OUTPUT
7400
IC 5
1
This circuit produces a variable number of burst pulses and spaces.
www.edn.com
JUNE 24, 2004 | EDN 79
T HE ADD-ON CIRCUIT in Figure 1 can
659318084.074.png 659318084.085.png 659318084.096.png 659318084.106.png 659318084.001.png 659318084.012.png 659318084.022.png 659318084.027.png 659318084.028.png 659318084.029.png 659318084.030.png 659318084.031.png 659318084.032.png 659318084.033.png 659318084.034.png 659318084.035.png 659318084.036.png 659318084.037.png 659318084.038.png 659318084.039.png 659318084.040.png 659318084.041.png 659318084.042.png 659318084.043.png 659318084.044.png 659318084.045.png 659318084.046.png 659318084.047.png 659318084.048.png 659318084.049.png 659318084.050.png 659318084.051.png 659318084.052.png 659318084.053.png 659318084.054.png 659318084.055.png 659318084.056.png 659318084.057.png 659318084.058.png 659318084.059.png 659318084.060.png 659318084.061.png 659318084.062.png 659318084.063.png 659318084.064.png 659318084.065.png 659318084.066.png 659318084.067.png 659318084.068.png 659318084.069.png 659318084.070.png 659318084.071.png 659318084.072.png 659318084.073.png 659318084.075.png 659318084.076.png 659318084.077.png 659318084.078.png 659318084.079.png
design
ideas
nected, so that when one counter is
counting, the other counter becomes dis-
abled. The two counters work in this
way, back and forth, counting up to 15
and enabling and disabling each other.
And finally for the two counters, when
the carry output on IC 2 goes high, the
circuit then, after it reaches a count of 15
through the inverter IC 3B , loads a new
count or reloads the old count into the
counters as set by the thumbwheel
switches for the next count.
When IC 1 is counting, the output of
IC 3A (the gate signal), assumes a high
level at AND gate IC 5 ’s Pin 2. This state
allows the clock signal to pass through
IC 5 unimpeded to the output. The out-
put of IC 5 is the burst output. When IC 1
is disabled and IC 2 is counting, the gate
signal from IC 3A asserts a low signal at
IC 5 ’s Pin 2. The output is also low and
produces no bursts. You can configure
this circuit to produce even more puls-
es or spaces by simply cascading more
counter chips where needed. Also, you
can replace switches S 1 and S 2 by an 8-
bit write-output register, making the
pulse and space counts software-con-
trolled, or you could apply the gate sig-
nal to the control input of a CMOS
switch to burst analog signals, such as
sine waves at its input.
Method provides fast, glitch-free
isolation of I 2 C and SMBus signals
Mark Thoren, Linear Technology Corp, Milpitas, CA
I 2 C IS A POPULAR SERIAL protocol for
V
V
power controllers, ADCs and DACs,
EEPROMs, and other devices. In cer-
tain data-acquisition and power-control
situations, you must isolate the I 2 C
master from one or more slave de-
vices for noise, grounding, or safety is-
sues. Also, although 128 peripherals may
connect to the bus, at some point, differ-
ences in ground potential and excessive
bus capacitance begin to erode noise and
timing margins. This Design Idea shows
how to provide fast, glitch-free optical
isolation of I 2 C or SMBus signals by us-
ing a method that meets the require-
ments for the 400-kHz enhanced-I 2 C-
bus specification. The I 2 C bus consists of
bidirectional clock and data lines (SCL
and SDA) that are pulled up with resis-
tors or current sources. Devices connect
to the bus with open-collector I/O pins.
One way to isolate I 2 C signals is with a
variation of the circuit shown in Figure
1 , which shows only SDA; SCL operation
is identical.
The circuit in Figure 1 works on the
principle that a device pulling the non-
isolated SDA line low turns on an opto-
coupler LED, pulling the isolated SDA
line low and disabling the isolated side’s
optocoupler LED and vice versa. Howev-
er, if devices on both sides of the isolation
barrier are pulling their respective SDA
lines low, the optocouplers are in an in-
determinate state, with both LEDs par-
tially on. When the nonisolated device re-
2k
Figure 1
BAT85
ISOLATED SDA
V
2k
HCPL2300#300
V
74HC125
BAT85
ISOLATED
GROUND
SDA
HCPL2300#300
74HC125
ISOLATED
GROUND
This circuit represents a simple I 2 C isolator.
leases its SDA line, the voltage on the line
rises until the isolated side’s LED can turn
fully on. Only then will the nonisolated
SDA line go low again. This situation oc-
curs at various times during I 2 C com-
munications, including clock synchro-
nization (on the SCL line), multimaster
arbitration, and SMBus interrupt arbi-
tration (on the SDA line). Figure 2 shows
details of the operation of the circuit in
Figure 1 . The 74HC125 tristate nonin-
verting buffers simulate the open-drain
out puts of two I 2 C devices. A logic low on
the EN line forces the output low, and a
logic high puts the output in a high-im-
pedance state. Traces 1 and 2 show the
inputs to the enable lines of the SDA and
isolated-SDA buffers. Traces 3 and 4 show
the outputs, respectively.
This type of circuit has been pub-
lished in a number of forms, often with
slow optocouplers that require 5 to 10
mA of LED drive. These circuits may
work in a limited set of applications, but
they are slow and still produce glitches,
and trying to overcome speed and drive
issues with high-speed components
makes the circuits almost unusable. The
80 EDN | JUNE 24, 2004
www.edn.com
659318084.080.png 659318084.081.png 659318084.082.png 659318084.083.png 659318084.084.png 659318084.086.png 659318084.087.png 659318084.088.png 659318084.089.png 659318084.090.png 659318084.091.png 659318084.092.png 659318084.093.png 659318084.094.png 659318084.095.png 659318084.097.png
 
design
ideas
A
of LED drive. If both SDA lines are held
low and then released at the same time,
the optocouplers fight each other and
form an oscillator ( Figure 3 ). The char-
acteristics of this oscillation depend on
When both sides are idling high, both
optocouplers are off. When one side
pulls its line below 0.4V (a safe assump-
tion for both open-collector and open-
drain outputs), the comparator turns on
its LED. The other side’s line pulls down
to approximately 0.6V, which is still in-
terpreted as a logic low but does not re-
sult in that side’s LED turning on. When
both sides are pulling their lines low,
both LEDs are on. In this state, if one side
releases its line, it rises cleanly from the
low level of the I 2 C device’s output to ap-
proximately 0.6V.
Figure 5 shows details of the op-
eration of the circuit in Figure 4 .The
combination of the LT1719 compara-
Figure 5
This scope photo shows the
operation of the improved
I 2 C isolator.
tor and Agilent (www.agilent.com)
HCPL2300 optoisolator meets the tim-
ing requirements of the 400-kHz en-
hanced I 2 C-bus specification. Total
propagation delay is approximately 100
nsec, and you can adjust the logic
thresholds to suit other requirements.
Although you can use this circuit for
both SDA and SCL lines to support full
clock synchronization, the extra cir-
cuitry is unnecessary as long as the
master never tries to communicate
faster than the slowest slave device. If
you don’t need clock synchronization,
you can use a single optocoupler for
SCL.
The simple I 2 C isolator pro-
duces large glitches under
some circumstances.
pullup resistance, supply voltage, and
capacitance on the data lines. (Remov-
ing one of the 9-pF scope probes stops
the oscillation, and replacing it with a
10-pF capacitor starts it up again.)
The circuit shown in Figure 4 solves
these problems by setting up three
logic levels: “high” (pulled up to 5V),
“pulling low,” and “being pulled low.”
Figure 3
Using high-speed components
in Figure 1’s circuit causes
unpredictable behavior.
5V
ISOLATED 5V
2k
SDA
LT1719
74HC125
169
V+
7.5k
11.5k
V
(0.4V)
HCPL2300
SHDN
1k
5V
ISOLATED 5V
5V
ISOLATED
GROUND
ISOLATED
GROUND
2k
LT1719
ISOLATED SDA
+
V+
Figure 4
11.5k
7.5k
169
74HC125
(0.4V)
_
V
The improved I 2 C
isolator is fast
and produces no
glitches.
SHDN
HCPL2300
1k
ISOLATED
GROUND
82 EDN | JUNE 24, 2004
www.edn.com
circuit in Figure 1 uses fast HCPL2300
optocouplers that require only 500
Figure 2
659318084.098.png 659318084.099.png 659318084.100.png 659318084.101.png 659318084.102.png 659318084.103.png 659318084.104.png 659318084.105.png 659318084.107.png 659318084.108.png 659318084.109.png 659318084.110.png 659318084.111.png 659318084.112.png 659318084.113.png 659318084.114.png 659318084.115.png 659318084.116.png 659318084.002.png 659318084.003.png 659318084.004.png 659318084.005.png 659318084.006.png 659318084.007.png 659318084.008.png 659318084.009.png 659318084.010.png 659318084.011.png 659318084.013.png
 
design
ideas
Simulate input-offset current for current mirrors
Johan Bauwelinck, Gent University, Gent, Belgium
S IMULATING THE OUTPUT-offset cur-
matches, and so on, the in-
put offset current is not
equal to zero. The design in
Figure 1 provides high ac-
curacy and a low simulation
time.
You use feedback to force
the current of a CCCS (cur-
rent-controlled current
source) to equal the input-
offset current. The current
that flows into voltage
source V OUT is the difference
between the output current
of the mirror and the
ideal output current.
This current is the “error
current” (I ERROR ). When the
CCCS equals the input-
offset current, then the
error current is zero. The
high-gain CCCS ampli-
fies the error current, and
the CCCS adds to the in-
put current. In this way,
you create a feedback
loop, and the current that
you measure through the
CCCS is the input-offset
current. The feedback
loop implements a high
gain that ensures a high
accuracy (negligible error
140
rent of a current mirror is straight-
forward. You simply have to apply an
input current, measure the output cur-
rent, and calculate the difference. This
output-offset current, however, is not
equal to the input-offset current, espe-
cially when the circuit is not a 1-to-1 mir-
ror. Simulating the input-offset current
with high accuracy is more complicated.
Suppose you’re dealing with a 1-to-1 mir-
ror and you want to know what input
current is needed to obtain an output
current of 10
120
100
80
60
40
20
A. Ideally, the input cur-
rent would be 10
0
–300 –200 –100 0 100 200 300 400 500 600 700
INPUT-OFFSET CURRENT (nA)
A, assuming that the
input offset current is zero. However, be-
cause of the finite beta of bipolar tran-
sistors, finite output impedances, mis-
Figure 2
This bar graph shows the input offset-current distribution.
current). And, because you obtain the re-
sult by calculating the dc operating
point, the simulation time is small.
Figure 2 shows simulation results of
500 Monte Carlo runs for I IDEAL
CCCS
G*I ERROR
I IDEAL
I IDEAL
10
A,
1V. The npn
transistors have an emitter length of 40
microns and use a 0.35-micron silicon-
germanium BiCMOS process, but you
can use the simulation method for all
current mirrors and all types of transis-
tors. The average of the distribution in
Figure 2 is 194 nA, and the standard de-
viation is 131 nA. The average is not zero
because of the base-current error.
1000, and V OUT
I ERROR
V OUT
Figure 1
Use this circuit for simulation of current-mirror input-offset currents.
Designing high-current chokes is easy
Louis Vlemincq, Belgacom, Evere, Belgium
Idea deals with a formula rather
than a circuit. You might think that
all the basic formulas of magnetic phe-
nomena were discovered more than a
century ago. In fact, they probably were,
but, at the time, some were of little prac-
tical interest and were essentially disre-
garded and never included in books or
formula tables. I developed the formu-
la describe here because I had to design
many inductive components subjected
to high peak currents, such as dc filter
chokes, ac reactors for resonant con-
verters, and flyback transformers. In
such cases, you have to consider two
main aspects: One is the current-carry-
ing capacity of the wire, and the other is
the peak induction that the core mate-
rial supports. The first point is well-
known and relatively easy to deal with,
but the magnetic induction is much
more problematic to determine.
The traditional methods of selecting a
suitable core size and air gap are gener-
ally based on tables or graphical infor-
mation. Examples of such methods in-
clude Hannah curves and energy-
storage-capacity graphs. I found these
methods cumbersome, inflexible, and al-
most impossible to automate; hence, I
looked for a better approach. I wanted a
formula as compact and elegant as the
84 EDN | JUNE 24, 2004
www.edn.com
gain G
S OMEWHAT UNUSUALLY, this Design
659318084.014.png 659318084.015.png 659318084.016.png 659318084.017.png 659318084.018.png 659318084.019.png 659318084.020.png 659318084.021.png 659318084.023.png 659318084.024.png 659318084.025.png
 
design
ideas
one that is at the base of a symmetrical
converter’s design: N
1. Select a core size that seems likely to
suit your application (The selection in-
formation that the manufacturer pro-
vides can be useful.)
2. Use the formula and the core’s data
sheet to compute the number of turns re-
quired for the worst-case situation—in
other words, the maximum peak current
and magnetic induction below the satu-
ration limit for the whole temperature
range.
3. Check that the resulting winding
does not exceed the capacity of the coil
former; if it does, select the next-higher
size.
4. Compute the air gap required to
achieve the target inductance using the
manufacturer’s data or the following for-
mula (approximate):
where
0 is the permeability of a vacu-
V/(4BFA), where
N is the number of turns required to
achieve the target induction, V is the volt-
age applied to the winding in volts, B is
the peak magnetic induction in the core
material in tesla, F is the frequency of op-
eration in hertz, and A is the effective
core area in square meters.
This formula is attractive because you
need only essential parameters; you need
not mess around with the permeability
or the length of the magnetic path, for ex-
ample. By combining and algebraically
manipulating the fundamental equations
of the magnetic formula, I arrived at a
similarly simple equality applicable to
inductors: N
10 7 ), and k is a factor that
depends on the implementation of the
air gap. For a single air gap, as in a po-
tentiometer core in which the center
pillar is machined, k
2. If, instead, you
use spacers such as in a U-core, the air
gap is split in two, and the factor k
1.
If you need high accuracy for the in-
ductance value, you should build a sam-
ple to optimize the gap. Also, for small
or large gaps, the formula loses its ac-
curacy because it assumes that the mag-
netic material has a negligible reluc-
tance compared with the air gap. If the
gap is small or if the core material has
a low permeability, the assumption
about negligible reluctance is no longer
true. At the other extreme, the first-or-
der term of the formula does not suffi-
ciently compensate for the apparent in-
crease in the core area that fringe fields
cause. Thus, discrepancies can exist be-
(LI)/(BA), where L is the
inductance in henries, and I is the in-
stantaneous peak current in amperes.
Here again, you need no more parame-
ters than the bare minimum. Using this
formula, a typical design procedure is:
86 EDN | JUNE 24, 2004
www.edn.com
um (4
659318084.026.png
 
Zgłoś jeśli naruszono regulamin