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A28F010
1024K (128K x 8) CMOS FLASH MEMORY
(Automotive)
Y
Automotive Temperature Range:
b
40
§
Cto
a
125
§
C
Y
Flash Memory Electrical Chip-Erase
Ð 1 Second Typical Chip-Erase
Y
Quick-Pulse Programming Algorithm
Ð10
m
s Typical Byte-Program
Ð 2 Second Chip-Program
Y
1,000 Erase/Program Cycles Minimum
over Automotive Temperature Range
Y
12.0V
g
5% V
PP
Y
High-Performance Read
Ð 120 ns Maximum Access Time
Y
CMOS Low Power Consumption
Ð 30 mA Maximum Active Current
Ð 300
m
A Maximum Standby Current
Y
Integrated Program/Erase Stop Timer
Y
Command Register Architecture for
Microprocessor/Microcontroller
Compatible Write Interface
Y
Noise Immunity Features
Ð
g
10% V
CC
Tolerance
ÐMaximum Latch-Up Immunity
through EPI Processing
Y
ETOX
TM
III Flash Nonvolatile Memory
Technology
Ð EPROM-Compatible Process Base
ÐHigh-Volume Manufacturing
Experience
Y
JEDEC-Standard Pinouts
Ð 32-Pin Plastic DIP
Ð 32-Lead PLCC
(See Packaging Spec., Order
Ý
231369)
Intel's 28F010 CMOS flash memory offers the most cost-effective and reliable alternative for read/write
random access nonvolatile memory. The 28F010 adds electrical chip-erasure and reprogramming to familiar
EPROM technology. Memory contents can be rewritten: in a test socket; in a PROM-programmer socket; on-
board during subassembly test; in-system during final test; and in-system after-sale. The 28F010 increases
memory flexibility, while contributing to time- and cost-savings.
The 28F010 is a 1024-kilobit nonvolatile memory organized as 131,072 bytes of 8 bits. Intel's 28F010 is
offered in 32-pin Plastic DIP or 32-lead PLCC packages. Pin assignments conform to JEDEC standards.
Extended erase and program cycling capability is designed into Intel's ETOX
TM
III (EPROM Tunnel Oxide)
process technology. Advanced oxide processing, an optimized tunneling structure, and lower electric field
combine to extend reliable cycling beyond that of traditional EEPROMs. With the 12.0V V
PP
supply, the
28F010 performs a minimum of 1,000 erase and program cycles well within the time limits of the Quick-Pulse
Programming and Quick-Erase algorithms.
Intel's 28F010 employs advanced CMOS circuitry for systems requiring high-performance access speeds, low
power consumption, and immunity to noise. Its 120 nanosecond access time provides no-WAIT-state perform-
ance for a wide range of microprocessors and microcontrollers. Maximum standby current of 300
m
A trans-
lates into power savings when the device is deselected. Finally, the highest degree of latch-up protection is
achieved through Intel's unique EPI processing. Prevention of latch-up is provided for stresses up to 100 mA
on address and data pins, from
b
1V to V
CC
a
1V.
With Intel's ETOX III process base, the 28F010 leverages years of EPROM experience to yield the highest
levels of quality, reliability, and cost-effectiveness.
In order to meet the rigorous environmental requirements of automotive applications, Intel offers the 28F010 in
extended automotive temperature range. Read and write characteristics are guaranteed over the range of
b
40
§
Cto
a
125
§
C ambient.
*Other brands and names are the property of their respective owners.
Information in this document is provided in connection with Intel products. Intel assumes no liability whatsoever, including infringement of any patent or
copyright, for sale and use of Intel products except as provided in Intel's Terms and Conditions of Sale for such products. Intel retains the right to make
changes to these specifications at any time, without notice. Microcomputer Products may have minor variations to this specification known as errata.
November 1995
Order Number: 290266-004
COPYRIGHT
©
INTEL CORPORATION, 1995
A28F010
290266±1
Figure 1. 28F010 Block Diagram
AUTOMOTIVE TEMPERATURE FLASH
MEMORIES
Speed
Packaging Options
Plastic DIP
Versions
PLCC
The Intel Automotive Flash memories have received
additional processing to enhance product character-
istics. The automotive temperature range is
b
40
§
C
to
a
125
§
C during the read/write/erase/program
operations.
150
AP
AN
120
AP
AN
2
A28F010
28F010
290266±3
290266±2
Figure 2. 28F010 Pin Configurations
Table 1. Pin Description
Symbol Type Name and Function
A
0
±A
16
INPUT ADDRESS INPUTS for memory addresses. Addresses are internally
latched during a write cycle.
DQ
0
±DQ
7
INPUT/OUTPUT DATA INPUT/OUTPUT: Inputs data during memory write cycles;
outputs data during memory read cycles. The data pins are active high
and float to tri-state OFF when the chip is deselected or the outputs
are disabled. Data is internally latched during a write cycle.
CE
Ý
INPUT
CHIP ENABLE: Activates the device's control logic, input buffers,
decoders and sense amplifiers. CE
Ý
is active low; CE
Ý
high
deselects the memory device and reduces power consumption to
standby levels.
OE
Ý
INPUT
OUTPUT ENABLE: Gates the devices output through the data buffers
during a read cycle. OE
Ý
is active low.
WE
Ý
INPUT
WRITE ENABLE: Controls writes to the control register and the array.
Write enable is active low. Addresses are latched on the falling edge
and data is latched on the rising edge of the WE
Ý
pulse.
Note: With V
PP
s
6.5V, memory contents cannot be altered.
V
PP
ERASE/PROGRAM POWER SUPPLY for writing the command
register, erasing the entire array, or programming bytes in the array.
V
CC
DEVICE POWER SUPPLY (5V
g
10%)
V
SS
GROUND
NC
NO INTERNAL CONNECTION to device. Pin may be driven or left
floating.
3
A28F010
APPLICATIONS
Designing with the in-circuit alterable 28F010 elimi-
nates socketed memories, reduces overall material
costs, and drastically cuts the labor costs associat-
ed with code updates. With the 28F010, code up-
dates are implemented locally via an edge-connec-
tor, or remotely over a serial communication link.
The 28F010 flash-memory adds electrical chip-era-
sure and reprogrammability to EPROM non-volatility
and ease of use. The 28F010 is ideal for storing
code or data-tables in applications where periodic
updates are required. The 28F010 also serves as a
dense, nonvolatile data acquisition and storage me-
dium.
The 28F010's electrical chip-erasure, byte repro-
grammability, and complete nonvolatility fit well with
data accumulation needs. Electrical chip-erasure
gives the designer a ``blank-slate'' in which to log
data. Data can be periodically off-loaded for analy-
sisÐerasing the slate and repeating the cycle. Or,
multiple devices can maintain a ``rolling window'' of
accumulated data.
The need for code updates pervades all phases of a
system's lifeÐfrom prototyping to system manufac-
ture to after-sale service. In the factory, during proto-
typing, revisions to control code necessitate ultravio-
let erasure and reprogramming of EPROM-based
prototype codes. The 28F010 replaces the 15- to
20-minute ultraviolet erasure with one-second elec-
trical erasure. Electrical chip-erasure and repro-
gramming occur in the same workstation or PROM-
programmer socket.
With high density, nonvolatility, and extended cycling
capability, the 28F010 offers an innovative alterna-
tive for mass storage. Integrating main memory and
backup storage functions into directly executable
flash memory boosts system performance, shrinks
system size, and cuts power consumption. Reliability
exceeds that of electromechanical media, with
greater durability in extreme environmental condi-
tions.
Diagnostics, performed at subassembly or final as-
sembly stages, often require the socketing of
EPROMs. Socketed test codes are ultimately re-
placed with EPROMs containing the final program.
With electrical chip-erasure and reprogramming, the
28F010 is soldered to the circuit board. Test codes
are programmed into the 28F010 as it resides on the
circuit board. Ultimately, the final code can be down-
loaded to the device. The 28F010's in-circuit altera-
bility eliminates unnecessary handling and less-reli-
able socketed connections, while adding greater
test flexibility.
A high degree of on-chip feature integration simpli-
fies memory-to-processor interfacing. Figure 3 de-
picts two 28F010s tied to the 80C186 system bus.
The 28F010's architecture minimizes interface cir-
cuitry needed for complete in-circuit updates of
memory contents.
With cost-effective in-system reprogramming and
extended cycling capability, the 28F010 fills the
functionality gap between traditional EPROMs and
EEPROMs. EPROM-compatible specifications,
straightforward interfacing, and in-circuit alterability
allows designers to easily augment memory flexibili-
ty and satisfy the need for updatable nonvolatile
storage in today's designs.
Material and labor costs associated with code
changes increase at higher levels of system integra-
tionÐthe most costly being code updates after sale.
Code ``bugs'', or the desire to augment system func-
tionality, prompt after-sale code updates. Field revi-
sions to EPROM-based code require the removal of
EPROM components or entire boards.
4
A28F010
290266±4
Figure 3. 28F010 in a 80C186 System
PRINCIPLES OF OPERATION
needed for programming or erase operations. With
the appropriate command written to the register,
standard microprocessor read timings output array
data, access the Intelligent Identifier codes, or out-
put data for erase and program verification.
Flash-memory augments EPROM functionality with
in-circuit electrical erasure and reprogramming. The
28F010 introduces a command register to manage
this new functionality. The command register allows
for: 100% TTL-level control inputs; fixed power sup-
plies during erasure and programming; and maxi-
mum EPROM compatibility.
Integrated Program/Erase Stop Timer
Successive command write cycles define the dura-
tions of program and erase operations; specifically,
the program or erase time durations are normally
terminated by associated program or erase verify
commands. An integrated stop timer provides simpli-
fied timing control over these operations; thus elimi-
nating the need for maximum program/erase timing
specifications. Program and erase pulse durations
are minimums only. When the stop timer terminates
a program or erase operation, the device enters an
inactive state and remains inactive until receiving the
appropriate verify or reset command.
In the absence of high voltage on the V
PP
pin, the
28F010 is a read-only memory. Manipulation of the
external memory-control pins yields the standard
EPROM read, standby, output disable, and Intelli-
gent Identifier operations.
The same EPROM read, standby, and output disable
operations are available when high voltage is ap-
plied to the V
PP
pin. In addition, high voltage on V
PP
enables erasure and programming of the device. All
functions associated with altering memory con-
tentsÐIntelligent Identifier, erase, erase verify, pro-
gram, and program verifyÐare accessed via the
command register.
Write Protection
The command register is only alterable when V
PP
is
at high voltage. Depending upon the application, the
system designer may choose to make the V
PP
pow-
er supply switchableÐavailable only when memory
updates are desired. When high voltage is removed,
Commands are written to the register using standard
microprocessor write timings. Register contents
serve as input to an internal state-machine which
controls the erase and programming circuitry. Write
cycles also internally latch addresses and data
5
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