Lead-Free

Underfill/Underfirm

POP (Part on Part)

Repair Procedures

Revision 1.0

14 June 2007

AP SERVICE ENGINEERING

This document and the information contained in it is CONFIDENTIAL Information of Motorola, and shall not be used, or published, or disclosed, or disseminated outside of Motorola in whole or in part without Motorola, Mobile Devices, Service Engineering

Revision History

Table of Contents

1.0              Introduction              4

1.1              Scope              4

1.2              Terms And Acronyms              4

1.3              Safety and ESD Precautions              4

1.4              Housekeeping              4

2.0              Lead Free              5

2.1              Equipment/Tools Set-up              5

2.2              Procedures              6

2.2.1              Removal of SMD Components              6

2.2.2              Removal of BGA Components              6

2.2.3              Placement of BGA Components              7

2.3              Inspection Criteria              7

3.0              Underfill/Underfirm Rework Procedures              8

3.1              Equipment/Tools Set-up              8

3.2              Underfill Rework Process              9

3.3              Underfilrm Rework Process              11

4.0              POP Parts Replacment              13

4.1              Equipment/Tools Set-up              13

4.2              Procedures              14

4.2.1              Set-up for POP IC Removal              14

4.2.2              POP IC Removal              14

4.2.3              POP - Argon IC Placement              16

4.2.4              Argon IC Current Check              17

4.2.5              POP – Flash IC Placement              18

4.2.6              Argon and Flash IC Current Check              18

4.2.7              Software Upgrading Procedures              19

4.2.8              POP IC Shield Placement              20

5.0              Appendix A - DIY Air Cooling System              21

6.0              Appendix B – Heat Shielding Methods              26

6.1              Using Kapton Tape on recycled shields              26

6.2              Using Enhanced Heat Shielding Tape on recycled shields              27

5.3              Using Aluminium Blocks to cool ICs              29

7.0              Appendix C – Soldering Visual Inspection              31

7.1              Purpose              31

7.2              Insepction Criteria              31

1.0             Introduction

1.1     Scope

This document describes procedures to PCB repair Lead-free (ROHS), Underfill/Underfilm production process, Removable Shield required for underfill/underfilm parts and special IC replacement for POP products

1.2     Terms And Acronyms

1.3     Safety and ESD Precautions

When performing any soldering tasks, following guidelines must be adhered upon :

·         Wear ground strap prior to the start of any reball operation.

·         Personnel with long hair must tie up neatly

·         Wear finger cots.

·         Do not touch the hot air  nozzle.

·         Do not direct any hot air / gases unto any part of the body.

·         Do not place any flammable material in the vicinity of the hot air / gas nozzle.

1.4     Housekeeping

·         Make sure to keep the rework area cleanliness and tidiness at all times

2.0             Lead Free

2.1     Equipment/Tools Set-up