PHILIPS LCD CHASSIS TPM5.1E LA.pdf
(
15620 KB
)
Pobierz
Colour Television
Chassis
TPM5.1
LA
18850_000_100107.eps
100209
Contents
Page
Contents
Page
1.
Revision List
2
11. Styling Sheets
Styling Sheet 32"
2.
Technical Specifications, Connections
2
68
3.
Precautions, Notes, and Abbreviation List
5
Styling Sheet 42"
69
4.
Mechanical Instructions
9
Styling Sheet 47"
70
5.
Service Modes, Error Codes, and Fault Finding 15
6.
Alignments
21
7.
Circuit Descriptions
24
8.
IC Data Sheets
28
9.
Block Diagrams
Wiring Diagram 32"
37
Wiring Diagram 42"
38
Block Diagram
40
10. Circuit Diagrams and PWB Layouts
Drawing PWB
Power 32"
(A01)
41
43-44
Inverter 32"
(A02)
42
43-44
Power 42" & 47"
(A01)
45
47-48
Inverter 42" & 47"
(A02)
46
47-48
SSB: Power-1
(B01)
49
64-65
SSB: Power-2
(B02)
50
64-65
SSB: Tuner
(B03)
51
64-65
SSB: MT5363 By-pass/Trap
(B04)
52
64-65
SSB: MT5363 peripheral/USB2.0
(B05)
53
64-65
SSB: DDR2 memory
(B06)
54
64-65
SSB: Flash/JTAG/UART/IR
(B07)
55
64-65
SSB: CI card
(B08)
56
64-65
SSB: Scart1/Scart2
(B09)
57
64-65
SSB: YPbPr/VGA input
(B10)
58
64-65
SSB: HDMI 1/ HDMI 2
(B11)
59
64-65
SSB: Audio Amp/Headphone out
(B12)
60
64-65
SSB: LVDS output
(B13)
61
64-65
SSB: T-CON power
(B14)
62
64-65
SSB: T-CON main chip
(B15)
63
64-65
IR/LED Board
(J)
66
67
EN 2
1.
TPM5.1E LA
Revision List
1.
Revision List
Manual xxxx xxx xxxx.0
• First release.
Manual xxxx xxx xxxx.1
Manual xxxx xxx xxxx.2
Added models 32HFL3232D/10 and 32PFL3205H/12 to
the manual
Added models 47PFL3605H/xx to the manual
Chapter 2:
Added new models in
Table 2-1
.
Chapter 2:
Added new models to
Table 2-1
.
Chapter 5:
Updated SAM contents.
Chapter 4:
added wiring diagrams and mechanical
information of 47" sets.
Chapter 6:
Add the panel codes in
Table 6-3
.
Chapter 4:
added information on returning a defect LCD
panel.
Chapter 5:
Updated SAM contents.
Chapter 6:
Added table 6-2 White tone default settings and
updated table 6-3 Panel codes overview.
Chapter 9:
Added 47" Wiring Diagram.
Chapter 11:
Added 47" Styling Sheet.
2.
Technical Specifications, Connections
Index of this chapter:
2.1 Technical Specifications
2.2 Directions for Use
2.3 Connections
2.4 Chassis Overview
2.2
Directions for Use
Directions for use can be downloaded from the following
websites:
http://www.philips.com/support
http://www.p4c.philips.com
Notes:
Figures can deviate due to the different set executions.
Specifications are indicative (subject to change).
2.1
Technical Specifications
For on-line product support please use the links in. Here is
product information available, as well as getting started, user
manuals, frequently asked questions and software & drivers.
Table 2-1 Described Model Numbers
Model Number
Styling
Published in
32HFL3232D/10
Dali
3122 785 18852
32PFL3205H/12
Dali
3122 785 18850
32PFL3605H/12
Dali
3122 785 18850
42PFL3605H/12
Dali
3122 785 18850
47PFL3605H/12
Dali
3122 785 18851
47PFL3605H/60
Dali
3122 785 18851
Note:
The given Model Numbers are subject to change.
Technical Specifications, Connections
TPM5.1E LA
2.
EN 3
2.3
Connections
1
6
7
8
2
9
3
10
4
11
5
12
13
18850_001_100107.eps
100209
Figure 2-1 Connection overview
Note:
The following connector colour abbreviations are used
(acc. to DIN/IEC 757): Bk= Black, Bu= Blue, Gn= Green,
Gy= Grey, Rd= Red, Wh= White, Ye= Yellow.
6
- D1-
Data channel
7
- D0+
Data channel
8
- Shield
Gnd
9
- D0-
Data channel
10
- CLK+
Data channel
2.3.1
Side Connections
11
- Shield
Gnd
12
- CLK-
Data channel
1 - Cinch: Video CVBS - In, Audio - In
Ye - Video CVBS
13
- n.c.
1 V
PP
/ 75
Ω
14
- n.c.
Rd - Audio R
0.5 V
RMS
/ 10 k
Ω
15
- DDC_SCL
DDC clock
Wh - Audio L
0.5 V
RMS
/ 10 k
Ω
16
- DDC_SDA
DDC data
17
- Ground
Gnd
2 - USB2.0
18
- +5V
19
- HPD
Hot Plug Detect
20
- Ground
Gnd
1
2 3 4
10000_022_090121.eps
090121
4 - Head phone (Output)
Bk - Head phone
80 - 600
Ω
/ 10 mW
Figure 2-2 USB (type A)
5 - Common Interface
68p - See diagram B08
SSB: CI card
.
1- 5V
2
- Data (-)
3
- Data (+)
2.3.2
Rear Connections
4
- Ground
Gnd
EN 4
2.
TPM5.1E LA
Technical Specifications, Connections
7 - EXT1 - 2: Video RGB/YC - In, CVBS - In/Out, Audio - In/
Out
3
- UART_RX
Receive
10 - EXT3: Video YPbPr - In, Audio - In
Gn - Video - Y
20
2
1 V
PP
/ 75 W
Bu - Video - Pb
0.7 V
PP
/ 75 W
Rd - Video - Pr
0.7 V
PP
/ 75 W
21
1
10000_001_090121.eps
090121
Wh - Audio - L
0.5 V
RMS
/ 10 kW
Figure 2-4 SCART connector
Rd - Audio - R
0.5 V
RMS
/ 10 kW
1
- Audio R
0.5 V
RMS
/ 1 k
Ω
11 - Audio - In: Left / Right, VGA
Gn - Audio L/R in
2
- Audio R
0.5 V
RMS
/ 10 k
Ω
0.5 V
RMS
/ 10 kW
3
- Audio L
0.5 V
RMS
/ 1 k
Ω
4
- Ground Audio
Gnd
12 - PC IN:VGA
5
- Ground Blue
Gnd
6
- Audio L
0.5 V
RMS
/ 10 k
Ω
1
6
5
10
7
- Video Blue/C-out 0.7 V
PP
/ 75
Ω
15
10000_002_090121.eps
090127
11
8
- Function Select
0 - 2 V: INT
4.5 - 7 V: EXT 16:9
9.5 - 12 V: EXT 4:3
9
- Ground Green
Gnd
Figure 2-5 VGA connector
10
- n.c.
11
- Video Green
0.7 V
PP
/ 75
Ω
1
- Video Red
0.7 V
PP
/ 75
Ω
12
- n.c.
2
- Video Green
0.7 V
PP
/ 75
Ω
13
- Ground Red
Gnd
3
- Video Blue
0.7 V
PP
/ 75
Ω
14
- Ground P50
Gnd
4- . .
5
15
- Video Red/C
0.7 V
PP
/ 75
Ω
- Ground
Gnd
16
- Status/FBL
0 - 0.4 V: INT
1 - 3 V: EXT / 75
Ω
6
- Ground Red
Gnd
7
- Ground Green
Gnd
17
- Ground Video
Gnd
8
- Ground Blue
Gnd
18
- Ground FBL
Gnd
9- 5V
DC
+5 V
19
- Video CVBS
1 V
PP
/ 75
Ω
10
- Ground Sync
Gnd
20
- Video CVBS/Y
1 V
PP
/ 75
Ω
11
- Ground Red
Gnd
21
- Shield
Gnd
12
- DDC_SDA
DDC data
13
- H-sync
0 - 5 V
8 - Cinch: S/PDIF - Out
Bk - Coaxial
14
- V-sync
0 - 5 V
0.4 - 0.6V
PP
/ 75 ohm
15
- DDC_SCL
DDC clock
9 - Service / UART
1
13 - HDMI 1: Digital Video, Digital Audio - In
See
3 - HDMI: Digital Video, Digital Audio - In
.
- Ground
Gnd
2
- UART_TX
Transmit
2.4
Chassis Overview
Refer to
9. Block Diagrams
for PWB/CBA locations.
Precautions, Notes, and Abbreviation List
TPM5.1E LA
3.
EN 5
3.
Precautions, Notes, and Abbreviation List
Index of this chapter:
3.1 Safety Instructions
3.2 Warnings
3.3 Notes
3.4 Abbreviation List
Where necessary, measure the waveforms and voltages
with (
) and without (
) aerial signal. Measure the
voltages in the power supply section both in normal
operation (
) and in stand-by (
). These values are
indicated by means of the appropriate symbols.
3.3.2
Schematic Notes
3.1
Safety Instructions
All resistor values are in ohms, and the value multiplier is
often used to indicate the decimal point location (e.g. 2K2
indicates 2.2 k
Ω
).
Safety regulations require the following
during
a repair:
Connect the set to the Mains/AC Power via an isolation
transformer (> 800 VA).
Resistor values with no multiplier may be indicated with
either an “E” or an “R” (e.g. 220E or 220R indicates 220
Ω
).
Replace safety components, indicated by the symbol
,
only by components identical to the original ones. Any
other component substitution (other than original type) may
increase risk of fire or electrical shock hazard.
All capacitor values are given in micro-farads (
μ=×
10
-6
),
nano-farads (n
=×
10
-9
), or pico-farads (p
=×
10
-12
).
Capacitor values may also use the value multiplier as the
decimal point indication (e.g. 2p2 indicates 2.2 pF).
Safety regulations require that
after
a repair, the set must be
returned in its original condition. Pay in particular attention to
the following points:
An “asterisk” (*) indicates component usage varies. Refer
to the diversity tables for the correct values.
The correct component values are listed on the Philips
Spare Parts Web Portal.
Route the wire trees correctly and fix them with the
mounted cable clamps.
Check the insulation of the Mains/AC Power lead for
external damage.
3.3.3
Spare Parts
Check the strain relief of the Mains/AC Power cord for
proper function.
For the latest spare part overview, consult your Philips Spare
Part web portal.
Check the electrical DC resistance between the Mains/AC
Power plug and the secondary side (only for sets that have
a Mains/AC Power isolated power supply):
1.
3.3.4
BGA (Ball Grid Array) ICs
Unplug the Mains/AC Power cord and connect a wire
between the two pins of the Mains/AC Power plug.
Introduction
For more information on how to handle BGA devices, visit this
URL:
http://www.atyourservice-magazine.com
.
Select
“Magazine”, then go to “Repair downloads”. Here you will find
Information on how to deal with BGA-ICs.
2.
Set the Mains/AC Power switch to the “on” position
(keep the Mains/AC Power cord unplugged!).
3.
Measure the resistance value between the pins of the
Mains/AC Power plug and the metal shielding of the
tuner or the aerial connection on the set. The reading
should be between 4.5 M
Ω
and 12 M
Ω
.
BGA Temperature Profiles
For BGA-ICs, you
must
use the correct temperature-profile.
Where applicable and available, this profile is added to the IC
Data Sheet information section in this manual.
4.
Switch “off” the set, and remove the wire between the
two pins of the Mains/AC Power plug.
Check the cabinet for defects, to prevent touching of any
inner parts by the customer.
3.3.5
Lead-free Soldering
3.2
Warnings
Due to lead-free technology some rules have to be respected
by the workshop during a repair:
All ICs and many other semiconductors are susceptible to
electrostatic discharges (ESD
). Careless handling
during repair can reduce life drastically. Make sure that,
during repair, you are connected with the same potential as
the mass of the set by a wristband with resistance. Keep
components and tools also at this same potential.
Use only lead-free soldering tin. If lead-free solder paste is
required, please contact the manufacturer of your soldering
equipment. In general, use of solder paste within
workshops should be avoided because paste is not easy to
store and to handle.
Be careful during measurements in the high voltage
section.
Use only adequate solder tools applicable for lead-free
soldering tin. The solder tool must be able:
–
Never replace modules or other components while the unit
is switched “on”.
To reach a solder-tip temperature of at least 400°C.
–
To stabilize the adjusted temperature at the solder-tip.
When you align the set, use plastic rather than metal tools.
This will prevent any short circuits and the danger of a
circuit becoming unstable.
–
To exchange solder-tips for different applications.
Adjust your solder tool so that a temperature of around
360°C - 380°C is reached and stabilized at the solder joint.
Heating time of the solder-joint should not exceed ~ 4 sec.
Avoid temperatures above 400°C, otherwise wear-out of
Plik z chomika:
Janekt56
Inne pliki z tego folderu:
PHILIPS LCD CHASSIS TPM5.1E LA.pdf
(15620 KB)
ch.tpm5.1e_la_134.rar
(405 KB)
instrukcja_Elemis solaris626_pl.pdf
(1252 KB)
50PJ350.pdf
(6834 KB)
le26 32 37 40 46s81bx GJA chassis.pdf
(6005 KB)
Inne foldery tego chomika:
3 D
Bajki
BlazeVideo HDTV Player Professional 6.6 + crack
Boguslaw_Woloszanski-SensacjeXX_Wieku
dokumentalne
Zgłoś jeśli
naruszono regulamin