FujiFilmS6000.pdf

DIGITAL CAMERA

FinePix S6000fd/

S6500fd

SERVICE MANUAL

US/EU/EG/EE/AS/CH/JP-Model

CAUTION

BECAUSE THIS PRODUCTIS RoHS LEAD-FREE COMPLIANT, USE THE DESIG-

NATED AFTER-SELES PARTS AND THE DESIGNATED LEAD-FREE SOLDER WHEN

PERFORMING REPAIRS. (Refer to page 3 to page 5)

WARNING

THE COMPONENTS IDENTIFIED WITH THE MARK “ ” ON THE SCHEMATIC

DIAGRAM AND IN THE PARTS LIST ARE CRITICAL FOR SAFETY.

PLEASE REPLACE ONLY WITH THE COMPONENTS SPECIFIED ON THE SCHEMATIC

DIAGRAM AND IN THE PARTS LIST.

IF YOU USE PARTS NOT SPECIFIED, IT MAY RESULT IN A FIRE AND AN

ELECTRICAL SHOCK.

FUJI PHOTO FILM CO., LTD.

Ref.No.:ZM00647-100

Printed in Japan 2006.09

FinePix S6000fd/S6500fd Service Manual

SAFETY CHECK-OUT

After correcting the original problem, perform the following

safety check before return the product to the customer.

1. Check the area of your repair for unsoldered or poorly

soldered connections. Check the entire board surface

for solder splasher and bridges.

CAUTION: FOR CONTINUED

PROTECTION AGAINST FIRE

HAZARD, REPLACE ONLY WITH

SAME TYPE 2.5 AMPERES 125V

FUSE.

2. Check the interboard wiring to ensure that no wires are

“pinched” or contact high-wattage resistors.

2.5A 125V

RISK OF FIRE-

REPLACE FUSE

AS MARKED

ATTENTION: AFIN D'ASSURER

UNE PROTECTION

PERMANENTE CONTRE LES

RISQUES D'INCENDIE,

REMPLACER UNIQUEMENT

PAR UN FUSIBLE DE MEME,

TYPE 2.5 AMPERES, 125 VOLTS.

3. Look for unauthorized replacement parts, particularly

transistors, that were installed during a previous repair.

Point them out to the customer and recommend their

replacement.

2.5A 125V

4. Look for parts which, though functioning, show obvious

signs of deterioration. Point them out to the customer

and recommend their replacement.

WARNING:

TO REDUCE THE ELECTRIC

SHOCK, BE CAREFUL TO

TOUCH THE PARTS.

5. Check the B + voltage to see it is at the values

specified.

6. Make leakage - current measurements to determine

that exposed parts are acceptably insulated from the

supply circuit before returning the product to the

customer.

WARNING!

HIGH VOLTAGE

FinePix S6000fd/S6500fd Service Manual

RoHS lead-free compliance

Because this product is RoHS lead-free compliant, use the designated after-sales parts and the designated lead-free solder

when performing repairs.

With the exception of parts and materials expressly excluded from the RoHS directive (*1), all the internal connections and

component parts and materials used in this product are lead-free compliant (*2) under the European RoHS directive.

*1: Excluded items (list of the main lead-related items)

• Lead included in glass used in fluorescent tubes, electronic components and cathode-ray tubes

• Lead in high-melting-point solder (i.e. tin-lead solder alloys that contain 85% lead or more)

• Lead in ceramic electronic parts (piezo-electronic devices)

• Mercury contained in fluorescent tubes is also excluded.

*2: Definition of lead-free

A lead content ratio of 0.1 wt% or less in the applicable locations (solder, terminals, electronic components, etc.)

RoHS: The name of a directive issued by the European Parliament aimed at restricting the use of

certain designated hazardous substances included in electrical and electronic equipment.

Designated substances (6): Lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBBs) and

polybrominated diphenyl ether (PBDE)

<Lead-free soldering>

When carrying out repairs, use a designated lead-free solder, bearing in mind the differing work practices for conventional

solder (eutectic) and lead-free solder.

Differences in the soldering work for lead-free and eutectic solder

When the soldering work practices for eutectic solder and lead-free solder are compared, the main differences are as shown

below. In particular, when lead-free solder is used, the solder tends to be less workable than when eutectic solder is used.

Accordingly, the soldering techniques used must take that into account.

Difference

The solder starts melting later.

Countermeasure

The initial melting point of lead-free solder is high, so you

have to get used to it.

Move the tip of the soldering iron around to heat the entire

connection to the melting temperature and assist wetting.

Use the solder (wire) diameter and soldering iron that are

best suited to connection being soldered.

First apply solder to the area immediately around the

through hold and then feed the solder into the hole.

Use a suitable wicking wire (with a suitable method and

heating) and a suction tool.

Either put solder onto the soldering iron tip after completing

the work, or turn the iron off frequently.

Learn to recognize the appearance of the surface.

Poor wetting

Solder feed rate is difficult to control.

Wetting the insides of through holes is especially

difficult.

During repairs (or modifications) removing solder

from inside through holes is difficult.

There is serious carbonization of the soldering iron.

The surface is not glossy.

FinePix S6000fd/S6500fd Service Manual

Setting temperature during lead-free soldering

• Lead-free solder melting temperature

The melting point of eutectic (Sn-Pb) solder is 183°C, while the melting point of lead-free solder (Sn-Ag-Cu) is 30°C higher

at 220°C.

• Soldering iron tip temperature

The temperature setting for the soldering iron used should be such that the tip of the soldering iron is at the correct

bonding temperature for the connection. This temperature is normally set at around 100°C higher than the melting point of

the solder.

However, the actual temperature should take into account the shape and size of the soldering iron tip, the heat tolerance

of the connection and the workability of that temperature.

• Correct bonding temperature

The correct bonding temperature refers not to the temperature of the heat source, but to the bonding temperature that will

give the best bond strength.

Precautions when soldering with lead-free solder

• Soldering iron maintenance

Because of the high soldering iron temperature in lead-free soldering, there is rapid carbonization of the flux adhering to

the tip of the soldering iron.

(1) Always cover the tip of the soldering iron with solder when it is not being used.

(2) If the tip is black from carbonization, wipe it gently with a paper towel soaked in alcohol until the solder will wet.

• Uniform heating of the board and components

To ensure that the lead-free solder wets the entire surface of the pattern and the lands despite its poor wetting

characteristics, you must move the tip of the soldering iron over a wide area to raise the temperature of the entire

connection.

Soldering iron

A soldering iron with a temperature control is best.

FinePix S6000fd/S6500fd Service Manual

Solder wire (thread)

Use the lead-free solders specified below.

Solder type: Sn96.5Ag3Cu0.5 (Displayed symbol: SnAgCu)

Wire diameter: 0.6, 0.8 or 1.0 mm

Sample:

lead-free

Wire diameter 0.8mm

Solder type (Displayed symbol)

SnAgCu

Flux

Conventional flux can be used.

Solder application wires (mesh, wicking wire, etc.)

Conventional application wires can be used.

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