SSS10N60A.PDF

FEATURES

BV DSS = 600 V

n Avalanche Rugged Technology

n Rugged Gate Oxide Technology

n Lower Input Capacitance

n Improved Gate Charge

n Extended Safe Operating Area

n Lower Leakage Current : 25 (Max.) @ V DS = 600V

n Low R DS(ON) : 0.646 (Typ.)

R DS(on) = 0.8

I D = 5.1 A

1.Gate 2. Drain 3. Source

Absolute Maximum Ratings

Symbol

Characteristic

Value

Units

V DSS

Drain-to-Source Voltage

Continuous Drain Current (T C =25 )

Continuous Drain Current (T C =100 )

Drain Current-Pulsed

Gate-to-Source Voltage

Single Pulsed Avalanche Energy

Avalanche Current

Repetitive Avalanche Energy

Peak Diode Recovery dv/dt

Total Power Dissipation (T C =25 )

Linear Derating Factor

Operating Junction and

Storage Temperature Range

Maximum Lead Temp. for Soldering

Purposes, 1/8 Ã from case for 5-seconds

600

5.1

3.2

709

5.1

3.0

0.4

I D

I DM

V GS

E AS

I AR

E AR

dv/dt

O 1

V/ns

O 2

O 1

O 3

P D

T J , T STG

- 55 to +150

T L

300

Thermal Resistance

Symbol

Characteristic

Typ.

Max. Units

R JC

R JA

Junction-to-Case

Junction-to-Ambient

2.5

62.5

Electrical Characteristics (T C =25 unless otherwise specified)

Symbol

Characteristic

Min.

Typ.

Max. Units

Test Condition

BV DSS

BV/ T J

V GS(th)

Drain-Source Breakdown Voltage

Breakdown Voltage Temp. Coeff.

Gate Threshold Voltage

Gate-Source Leakage , Forward

Gate-Source Leakage , Reverse

600

2.0

0.66

4.0

100

-100

250

V GS =0V,I D =250 A

I D =250 A See Fig 7

V DS =5V,I D =250 A

V GS =30V

V GS =-30V

V DS =600V

V DS =480V,T C =125

D D

I GSS

I DSS

Drain-to-Source Leakage Current

R DS(on)

Static Drain-Source

On-State Resistance

Forward Transconductance

Input Capacitance

Output Capacitance

Reverse Transfer Capacitance

Turn-On Delay Time

Rise Time

Turn-Off Delay Time

Fall Time

Total Gate Charge

Gate-Source Charge

Gate-Drain( ÃMiller Ã) Charge

0.8

V GS =10V,I D =2.55A

V DS =50V,I D =2.55A

g fs

C iss

C oss

C rss

t d(on)

t r

t d(off)

t f

Q g

Q gs

Q gd

6.23

1750

2270

220

180

V GS =0V,V DS =25V,f =1MHz

See Fig 5

190

35.4

V DD =300V,I D =10A,

R G =6.2

See Fig 13

V DS =480V,V GS =10V,

I D =10A

See Fig 6 & Fig 12

Source-Drain Diode Ratings and Characteristics

Symbol

Characteristic

Min.

Typ.

Max. Units

Test Condition

I S

I SM

V SD

t rr

Q rr

Continuous Source Current

Pulsed-Source Current

Diode Forward Voltage

Reverse Recovery Time

Reverse Recovery Charge

O 1

440

4.7

5.1

1.4

Integral reverse pn-diode

in the MOSFET

T J =25 ,I S =5.1A,V GS =0V

T J =25 ,I F =10A

di F /dt=100A/ s

Notes ;

Repetitive Rating : Pulse Width Limited by Maximum Junction Temperature

L=50mH, I AS =5.1A, V DD =50V, R G =27 , Starting T J =25

I SD 10A, di/dt 150A/ s, V DD BV DSS , Starting T J =25

Pulse Test : Pulse Width = 250 s, Duty Cycle 2%

Essentially Independent of Operating Temperature

O 1

O 2

O 3

Fig 1. Output Characteristics

Fig 2. Transfer Characteristics

V GS

Top : 1 5 V

1 0 V

8.0 V

7.0 V

6.0 V

5.5 V

5.0 V

Bott om : 4.5 V

Fig 3. On-Resistance vs. Drain Current

Fig 4. Source-Drain Diode Forward Voltage

Fig 5. Capacitance vs. Drain-Source Voltage

Fig 6. Gate Charge vs. Gate-Source Voltage

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Fig 7. Breakdown Voltage vs. Temperature

Fig 8. On-Resistance vs. Temperature

Fig 9. Max. Safe Operating Area

Fig 10. Max. Drain Current vs. Case Temperature

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Fig 11. Thermal Response

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Fig 12. Gate Charge Test Circuit & Waveform

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Fig 13. Resistive Switching Test Circuit & Waveforms

Fig 14. Unclamped Inductive Switching Test Circuit & Waveforms

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