Sony TA-FB740R.pdf

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TA-FB740R
TA-FB740R
SERVICE MANUAL
AEP Model
UK Model
E Model
Australian Model
SPECIFICATIONS
Amplifier section
General
DIN power output
100 W + 100 W (4
System
at 1 kHz)
60 W + 60 W (8 Ω at 1 kHz)
Ω
Power amplifier: Pure-complementary SEPP OCL
power amplifier with all stages directly coupled
Preamplifier: Low-noise, equalizer amplifier
Total harmonic distortion
Less than 0.008% (at 10 W output 1 kHz)
Power requirements
230 V AC, 50/60 Hz
Frequency response
PHONO (20 Hz - 20 kHz): RIAA equalization curve
±0.5 dB
TUNER, SACD/CD, AUX, TAPE1/DAT, TAPE2/MD:
7 Hz - 300 kHz
Power consumption
180 W
+ –3 dB
Dimensions (approx.) (w/h/d)
430 × 150 × 420 mm
incl. projecting parts and controls
S/N (network A)
PHONO
90 dB
Mass (approx.)
8.6 kg
TUNER, SACD/CD, AUX, TAPE1/DAT, TAPE2/MD:
105 dB
Output voltage/impedance
REC OUT 1, 2: 150 mV, 1 kΩ
PHONES: 10 mW (at 8 Ω)
Supplied accessories
• Remote commander (remote) (1) RM-S336
• Sony batteries R6 (size-AA) (2)
Speakers impedance
4 - 16 Ω, 8 - 16 Ω (SPEAKERS A+B)
Design and specifications are subject to change without
notice.
Damping factor
500 (8 Ω, 1 kHz)
INTEGRATED STEREO AMPLIFIER
1
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TABLE OF CONTENTS
1. GENERAL .......................................................................... 3
2. ELECTRICAL ADJUSTMENT ..................................... 4
3. DIAGRAMS
3-1. Circuit Boards Location ........................................................ 5
3-2. Schematic Diagram – Input Section – .................................. 6
3-3. Printed Wiring Board – Input Section – ................................ 7
3-4. Schematic Diagram – Main Section – .................................. 8
3-5. Printed Wiring Board – Main Section – ................................ 9
3-6. Schematic Diagram – Panel Section – ................................ 10
3-7. Printed Wiring Board – Panel Section – ............................. 11
3-8. Schematic Diagram – Power Section – ............................... 12
3-9. Printed Wiring Board – Power Section – ............................ 13
3-10. IC Block Diagrams ............................................................ 14
3-11. IC Pin Function ................................................................. 14
4. EXPLODED VIEW
4-1. Case Section ........................................................................ 15
4-2. Front Panel Section ............................................................. 16
4-3. Chassis Section ................................................................... 17
5. ELECTRICAL PARTS LIST ........................................ 18
SAFETY-RELATED COMPONENT WARNING !!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
2
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SECTION 1
GENERAL
Front Panel Descriptions
2
3
4
5
6
7
8
9
1
10
11
23
22
21
20
19
18
17
16
15
14
13
12
1 PROTECTION indicator
2 POWER button
3 Remote sensor
4 TAPE 1/DAT indicator
5 TAPE 2/MD indicator
6 AUX indicator
7 CD indicator
8 TUNER indicator
9 PHONO indicator
10 INPUT SELECTOR knob
11 VOLUME knob
12 SUBSONIC button
13 SOURCE indicator
14 SOURCE DIRECT button and indicator
15 LOUDNESS button
16 TAPE MONITOR knob
17 BALANCE knob
18 TREBLE knob
19 BASS knob
20 SPEAKERS knob
21 PHONE jack
22 EON LINK button
23 EON LINK indicator
This section is extracted from
instruction manual.
Rear Panel Descriptions
1
2
3
4
5
AC OUTLET
SWITCHED 100W MAX
PHONO
IN
IMPEDANCE USE 4–16
Ω
SIGNAL
GND
U
A+B USE 8–16
Ω
BI WIRE USE 4–16
Ω
L
SPEAKERS
R
+
R
–
–
L
+
B
L
L
EON CONTROL
A
R
R
IN
IN
IN
REC OUT
IN
REC OUT
IN
+
R
–
–
L
+
TUNER
SACD/
CD
AUX
TAPE2/MD
TAPE1/DAT
IN
qa 9 8 7
0
6
1 PHONO
2 U (SIGNAL GND)
3 SPEAKERS A/B
4 EON CONTROL IN
5 AC OUTLET
(Except UK, Singapore, Malaysia)
6 Mains lead
7 TAPE1/DAT
8 TAPE2/MD
9 AUX
0 SACD/CD
qa TUNER
3
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SECTION 2
ELECTRICAL ADJUSTMENT
Bias Adjustment
NOTE:
1. Perform the adjustment after the unit has warmed up sufficiently.
2. Perform the bias adjustment if the power transistor has been
replaced.
Procedure:
1. Rotate fully the bias adjusting semi-fixed resistors (RV500,
RV600) to the MIN position (counterclockwise).
2. Connect a digital voltmeter to the CN500 and CN600.
1 pin
2 pin
–
–
CN500 (L-CH)
CN600(R-CH)
+
+
3. Set the slide regulator to 0V, and press the POWER button
(ON) on the set.
4. Raise gradually the slide regulator voltage up to the rated voltage.
5. At this time, confirm that the SP relay is turned on (it will click).
6. Adjust the RV500 and RV600 so that a reading of digital
voltmeter is 7 ± 1 mV.
7. Return the slidack to 0 V, and press the POWER button (OFF)
on the set.
Adjustment Location :
[MAIN BOARD] – COMPONENT SIDE –
12
CN500
(L-CH)
RV500
Bias (L-CH)
RV600
Bias (R-CH)
21
CN600
(R-CH)
+
+
DIGITAL
VOLTMETER
DIGITAL
VOLTMETER
4
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SECTION 3
DIAGRAMS
3-1. CIRCUIT BOARDS LOCATION
THIS NOTE IS COMMON FOR PRINTED WIRING
BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed
in each block.)
WAVEFORM
1
3.8Vp-p
For schematic diagrams.
Note:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and 1 / 4 W or less unless otherwise
specified.
• f : internal component.
• 2 : nonflammable resistor.
• 5 : fusible resistor.
• C : panel designation.
4MHz
IC902 1 XOUT
PS board
OUTLET board
(EXCEPT UK, SP, MY)
SP-TM board
SIRCS board
Note: The components identified by mark 0 or dotted line
with mark 0 are critical for safety.
Replace only with part number specified.
PHONO board
SIRCS SUB board
• U : B+ Line.
• V : B– Line.
• H : adjustment for repair.
• Voltages and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
no mark : POWER ON
• Voltages are taken with a VOM (Input impedance 10 M
).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F : TUNER
Ω
HP board
SP-SW board
INPUT board
PANEL board
MAIN board
For printed wiring boards.
Note:
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
• b : Pattern from the side which enables seeing.
VOL board
• Indication of transistor
B
C
E
These are omitted
• Abbreviation
G : German model
SP : Singapore model
MY : Malaysia model
AUS : Australian model
EE
: East European model
5
5
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